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2/28/2011 8:20:10 AM
Microelectronics Innovation Collaborative Centre Licenses Alchimer’s Wet Deposition Products for MEMS 3D Research

Alchimer, a leading provider of nanometric deposition technology for through-silicon vias (TSVs), semiconductor interconnects, MEMS and other electronic applications, today announced that the Centre de Collaboration MiQro Innovation / MiQro Innovation Collaborative Centre (C2MI) has licensed its suite of products.

The C2MI, which includes a state-of-the-art MEMS facility, was launched in 2009 by Université of Sherbrooke in Bromont Technoparc, Quebec, Canada. The center’s 200mm MEMS and 3D wafer-level-processing (WLP) equipment, which is among the most advanced in the world, will enable its members to test a variety of materials for MEMS production.

Alchimer’s suite of products and its Electrografting (eG) technology will support the center’s 3D MEMS programs. Electrografting is Alchimer’s breakthrough electrochemical process that enables the growth of extremely high-quality polymer and metal thin films.

“The MiQro Innovation Collaborative Centre and its members are at the leading edge of 3D integration in MEMS,” said Alchimer CEO Steve Lerner. “They are pushing the design rules in this space, and we are excited that they have chosen our products to support this work. This is another solid technical validation for Alchimer’s products and wet deposition technology.”

“Alchimer’s Electrografting technology dramatically increases yields in MEMS, 3D-IC and on-chip interconnects, and provides strong support for work in advancing the technology for 3D MEMS manufacturing with a cost-effective approach,” said Luc Ouellet, vice-president of R&D at Teledyne DALSA Semiconductor, the number-one pure-play MEMS foundry in the world

Alchimer S.A.

Alchimer develops and markets innovative chemical formulations, processes and IP for the deposition of nanometric films used in a variety of microelectronic and MEMS applications, including wafer-level interconnects and TSVs (through-silicon vias) for 3D packaging. The company’s breakthrough technology, Electrografting (eG), is an electrochemical-based process that enables the growth of very thin coatings, of various types, on both conducting and semiconducting surfaces. Alchimer’s potential was initially recognized by the Strategic Industrial Innovation Programme of OSEO, which supports state-of-the-art technologies with a high likelihood of commercialization, and the company was spun off from the Commissariat à l’Energie Atomique (CEA) in 2001. Based in Massy, France, it won the First National Award for the Creation of High Tech Companies from the French Minister of Research and Industry and is a Red Herring Top 100 European Company. Visit http://alchimer.com.

C2MI

The MiQro Innovation Collaborative Centre (C2MI) is an original partnership between Université de Sherbrooke and microelectronics industry leaders. Together, these founding partners have created an ecosystem which will facilitate recruiting other industrial and academic partners. Academic and industrial researchers will closely work together in an original way.

The initial investment (building and research equipment) of $218.45 million is supported by Industry Canada ($82.95 million), by the ministère du Développement économique, de l'Innovation et de l'Exportation ($94.9 million), by the town of Bromont (taxe exemption for 10 years, a $15 million value), by the founding partners and equipment suppliers ($40.6 million). Visit http://www.c2mi.ca.

Other Headlines from Alchimer S.A. ...
 - Microelectronics Innovation Collaborative Centre Licenses Alchimer’s Wet Deposition Products for MEMS 3D Research
 - RTI International Validates Alchimer’s Electrografting Technology for 3D TSV Applications
 - Alchimer Receives Equity Investment From Panasonic Corporation
 - Alchimer Opens 300mm Applications-and-Development Facility in Asia
 - New Alchimer Seedless Wet Deposition Technology Eliminates Entire Step From TSV Film Stack Process

More MEMS Headlines ...
 - BMC to Develop Enhanced Reliability MEMS Deformable Mirrors for Space Imaging
 - Freescale and CEA-Leti Celebrate 10 Years of MEMS Collaboration
 - Panasonic and imec present thin film packaged MEMS resonator with industry record Q factor and low bias voltage
 - GLOBALFOUNDRIES Partners With SVTC to Accelerate High-Volume MEMS Manufacturing
 - RF MEMS Devices Posed to Revolutionise Communications


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