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11/22/2004 5:33:36 PM
Ultratech Receives Order From DRAM Manufacturer for AP300 Lithography System Built on the Unity Platform

Ultratech, Inc., a leading supplier of lithography and laser-processing systems used to manufacture semiconductors and nanotechnology devices, today announced that it has received an order from a DRAM manufacturer for its AP300 lithography system, built on the new Unity Platform. The customer intends to utilize Ultratech's AP300 -- capable of processing both 200- and 300-mm wafers -- for wafer-level chip scale packaging (WLCSP) solutions. This order highlights the adoption of the company's Unity Platform design and supports Ultratech's position as a market leader at the forefront of the migration from wire bonding to WLCSP.

Market research firm TechSearch International, Inc. expects a five-fold increase in the WLCSP market between 2004 and 2007. Behind this rapid growth is an increasing demand for integrated passives, power devices and DRAM that require advanced packaging technology. To meet the speed requirements of today's high-end graphic memory devices, DRAM manufacturers are moving from wire bonding to WLCSP, which enables increased device performance and the ability to meet shrinking form-factor design rules.

"The AP300 system order for our customer's pilot WLCSP production line shows Ultratech's advanced packaging technology expertise and market leadership. The order from a DRAM manufacturer demonstrates that the memory market is beginning the migration from wire bonding to WLCSP," noted Stephen Kay, director, product marketing for Ultratech's Advanced Packaging Technology. "Ultratech's technology expertise, including the AP300's outstanding flexibility, extendibility and advanced lithography technology for 200- and 300-mm wafer processing, we believe played an important role in the customer's selection criteria. In addition, Ultratech is strategically positioned to support the DRAM manufacturing industry as it transitions to WLCSP technology. We look forward to supporting customer requirements for cost-effective DRAM manufacturing -- today and in the future."

Ultratech, Inc. designs, manufactures and markets photolithography equipment used worldwide in the fabrication of semiconductor and nanotechnology devices, and has expanded its technology scope in pioneering laser processing technology for IC manufacturing. Founded in 1979, Ultratech is a market leader in gold and solder bump lithography. Its products are designed to substantially reduce the cost of ownership for manufacturers in the electronics industry. The company's home page on the World Wide Web is located at http://www.ultratech.com.

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