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12/14/2004 10:04:01 PM
EV Group Launches a Step-and-Repeat Nanoimprint Lithography System for Industrial Fabrication of Nanoscale Devices

EV Group (EVG), a leading manufacturer of MEMS, nano and semiconductor wafer-processing equipment, said today it will install a fully automated, ultra-violet step-and-repeat nanoimprint lithography (UV-NIL) system at AMO GmbH (AMO) in Germany.

UV-NIL is a next-generation lithography technology and a contender to succeed optical lithography for the 32-nm node, according to the International Technology Roadmap of Semiconductor (ITRS). Applications include integrated photonic devices, nanoelectronics, life sciences, patterned media and next-generation memories.

"Nanoimprint lithography is an innovative patterning technology that provides a lower cost-of-ownership model compared to current manufacturing lithography tools," said Dr. Peter Podesser, chief executive officer of EV Group. "EV Group has the largest installation base worldwide for single-step imprinting equipment and this new NIL stepper enhances our product portfolio substantially."

AMO, which has been participating in joint-development programs with EVG in the area of advanced UV-NIL since 1997, is a leading research center for the technology. In addition, AMO is a charter member of NILCom, the consortium founded by EV Group that is dedicated to speeding the commercialization of NIL. NILCom is a technology platform supported by an established infrastructure and qualified processes, including leading technology companies and research centers. Its mission is to establish a high-volume manufacturing NIL platform in nano-electronics, data storage, life sciences and opto-electronics.

The special features of EV Group's new NIL stepper include a dual-stage alignment approach in lower pressure environments, which enhances pattern fidelity compared to other technical solutions in ambient pressure. The step-and-repeat NIL system targets sub-50-nm overlay alignment accuracy and a lithography resolution down to 10 nm. The system will be delivered in the first quarter of 2005.

Other Headlines from EV Group ...
 - CEA-Leti to Implement Multiple EV Group Systems on Its New 300-mm Fab Line Dedicated to 3D Integration
 - EV Group Recognized as Leader in Nanoimprint Lithography With Frost & Sullivan 2010 Technology Innovation Award
 - Shrink Nanotechnologies' Shrink Chips Cell Culturing Unit Enters Into Exclusive Development and Manufacturing Agreement with EV Group to Commercialize the StemDisc Platform
 - New Wafer-Level Microlens Molding Process From EV Group Extends Manufacturing Roadmap for CMOS Image Sensors
 - EV Group's GEMINI Wafer Bonder Selected by MEMS Pioneer Sensonor for High-Volume Production of Thermal Imaging Devices

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