Looking into the future 25 years is perhaps a task better suited to soothsayers than scientists and industry professionals. However, given the rate of technology innovation that the semiconductor industry is undergoing presently, it would come as no surprise if device manufacturers continued on the pace of rapid technology developments in design, manufacturing technology and new packaging implementation. Moore's Law of smaller, faster, cheaper devices will persist, but with strong consideration for the needs for reduced power consumption and better heat dissipation. "The power problem," as it has been called, will require equally innovative solutions to those of pushing faster clock speed on microprocessors and increasing storage capability in memory devices.
A concept called ambient intelligence, where technology is embedded in our natural surroundings, ever present and available for access by the individual, will be accomplished within the next 25 years. What is unclear is the way it will be implemented, and whether certain products will prove feasible and affordable such as paper-like displays and small sensors embedded in paint that might facilitate communication in houses and hotels.
A combination of key capabilities will be needed to bring nanotechnology and ambient intelligence into the mainstream about two decades from now — in design, design-for-manufacturing, materials synthesis using, for instance, self assembly, development of new interconnect approaches such as carbon nanotubes, and 3-D interconnect and 3-D packaging alternatives. Nanotechnology not only requires interaction among the circuit, chip and system designers and manufacturers, but also cross-pollination of disciplines among biological, chemical, mechanical and electrical functions, which is already occurring today.
