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9/9/2008 6:50:39 PM
SUSS MicroTec Introduces New Production Wafer Bonder for CMOS Image Sensor Market

At this year’s Semicon Taiwan, from September 9 to 11 in Taipei, SUSS MicroTec, a leading supplier of process and test solutions for the semiconductor industry, introduces the XBC300 Production Wafer Bonder for the CMOS Image Sensor (CIS) market. Visitors will have the opportunity to learn more about the world’s first wafer bonder product family specifically designed for CMOS Image Sensor production.

The XBC300 is designed for 300mm wafer bonding for the integration and packaging of CMOS Image Sensors. The XBC300 performs a wide range of wafer bonding processes in the smallest footprint possible. The high throughput capabilities of the XBC300 combined with the smallest production footprint in the market today optimizes cost of ownership for CIS applications.

”For new applications like image sensors it is important to have dedicated solutions to ensure the highest throughput with the lowest cost of ownership, “ said Wilfried Bair, VP Strategic Business Development, “we are excited to have the XBC300 to offer in this capacity.”

Other Headlines from SUSS MicroTec ...
 - SUSS MicroTec Announces Collaboration in Nano Research with Cornell University
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 - SUSS MicroTec Extends Technological and Market Leadership of its Photomask Equipment Division
 - SUSS MicroTec and Fraunhofer IST Introduce New Technology for Selective Surface Treatment
 - AMO and SUSS MicroTec collaborating in the field of nanoimprint on development of UV-SCIL

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