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12/23/2008 12:41:49 AM
3M and EV Group Settle Patent Infringement Suit

3M and EV Group (EVG) have agreed to settle the patent infringement litigation brought by EVG against 3M in the U.S. District Court for the Southern District of New York relating to systems for temporary wafer bonding.

Under the terms of the settlement, the details of which are confidential, 3M, its customers, and 3Mís licensed suppliers of 3M's Wafer Support System will continue to make, sell and use the Wafer Support System in global semiconductor and packaging markets. EVG will continue to defend its patent portfolio and protect its intellectual property.

EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. To protect the tremendous investment in research and development, which allows EVG to be at the forefront of setting new standards and bringing emerging applications to market, the companyís products and processes are covered by numerous patents. For more information, visit http://www.evgroup.com.

A recognized leader in research and development, 3M produces thousands of innovative products for dozens of diverse markets. 3Mís core strength is applying its more than 40 distinct technology platforms Ė often in combination Ė to a wide array of customer needs. With $24 billion in sales, 3M employs 79,000 people worldwide and has operations in more than 60 countries. For more information, visit http://www.3M.com.

Other Headlines from 3M ESPE ...
 - 3M and SUSS Announce Agreement on Temporary Wafer Bonding Technology to Enable 3-D Semiconductors
 - 3M and EV Group Settle Patent Infringement Suit
 - 3M ESPE introduces nanotechnology-based temporization solution

Other Headlines from EV Group ...
 - CEA-Leti to Implement Multiple EV Group Systems on Its New 300-mm Fab Line Dedicated to 3D Integration
 - EV Group Recognized as Leader in Nanoimprint Lithography With Frost & Sullivan 2010 Technology Innovation Award
 - Shrink Nanotechnologies' Shrink Chips Cell Culturing Unit Enters Into Exclusive Development and Manufacturing Agreement with EV Group to Commercialize the StemDisc Platform
 - New Wafer-Level Microlens Molding Process From EV Group Extends Manufacturing Roadmap for CMOS Image Sensors
 - EV Group's GEMINI Wafer Bonder Selected by MEMS Pioneer Sensonor for High-Volume Production of Thermal Imaging Devices

More Litigation Headlines ...
 - Integran Files Patent Infringement Claims Against Modumetal, Inc.
 - Nanosys Reaches Settlement of Patent Infringement Lawsuit Against Nanoco Technologies for Quantum Dot Technology
 - High Court Rules Oxford University Spin-Out Oxonica Breached Patent License
 - Asylum Research Settles Patent Dispute with Veeco
 - EV Group Files Patent Infringement Lawsuit Against the 3M Company


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