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7/8/2004 6:51:24 PM
EV Group Unveils NanoAlign Technology, New Mask Aligner at SEMICON West

EV Group, a leading supplier of wafer-bonding and lithography equipment, today announced that it has developed an advanced aligner technology that improves competitiveness of full-field lithography by providing the industry's highest alignment accuracy and resolution at lowest cost of ownership. The new NanoAlign Technology features active run-out control and sub-100nm dynamic alignment resolution, complemented by UV-Nanoimprint (UV-NIL) capability.

EV Group's NanoAlign Technology is especially useful for packaging up to 300-mm wafers, UV-NIL, micro-contact printing, SAW devices and optical gratings. It is available on all EV Group's mask aligner platforms, including the all-new EVG6200 Infinity aligner. The Infinity, which will be launched in the North American market during SEMICON West, is designed for all MEMS, compound semiconductor, nanoimprint lithography and power-device applications, as well as the wafer-bumping and chip-scale packaging markets.

"Our NanoAlign technology will enable our customers to use 1X full-field Lithography as a more cost-effective alternative to step-and-repeat approaches in markets such as advanced packaging," said Dr. Peter Podesser, chief executive officer of EV Group. "This combination of NanoAlign Technology's standard-setting accuracy, resolution and value with the entirely new Infinity aligner positions EV Group at the forefront of this market."

The Infinity supports a wide range of configurations, including large gap alignment, bowed and thin wafer processing. The fully automated EVG6200 Infinity offers unmatched investment protection, in part because it can be reconfigured and upgraded onsite with unique alignment and bonding features.

The EVG6200 Infinity is the culmination of EV Group's new aligner-technology roadmap, with features for manufacturing of a variety of 75mm-to-300mm wafers. With full-field proximity exposure of very thick resist layers, the new aligner is optimized for highest throughput, highest mean time between failures and most accurate print-gap settings.

The company's aligner-technology roadmap has evolved through extensive discussions with customers and was supported by EV Group's recognized strengths and commitment to research and development. EV Group's new aligner roadmap, which includes upgrades of the EVG620 and the IQ Aligner, positions the company to serve customers with both pilot and high-volume production needs.

The new aligner, which already has been ordered by several customers, also features the unique bond-alignment capabilities of EV Group's existing aligners, the EVG620 and the IQ Aligner.

Other Headlines from EV Group ...
 - CEA-Leti to Implement Multiple EV Group Systems on Its New 300-mm Fab Line Dedicated to 3D Integration
 - EV Group Recognized as Leader in Nanoimprint Lithography With Frost & Sullivan 2010 Technology Innovation Award
 - Shrink Nanotechnologies' Shrink Chips Cell Culturing Unit Enters Into Exclusive Development and Manufacturing Agreement with EV Group to Commercialize the StemDisc Platform
 - New Wafer-Level Microlens Molding Process From EV Group Extends Manufacturing Roadmap for CMOS Image Sensors
 - EV Group's GEMINI Wafer Bonder Selected by MEMS Pioneer Sensonor for High-Volume Production of Thermal Imaging Devices

More MEMS Headlines ...
 - BMC to Develop Enhanced Reliability MEMS Deformable Mirrors for Space Imaging
 - Freescale and CEA-Leti Celebrate 10 Years of MEMS Collaboration
 - Microelectronics Innovation Collaborative Centre Licenses Alchimer’s Wet Deposition Products for MEMS 3D Research
 - Panasonic and imec present thin film packaged MEMS resonator with industry record Q factor and low bias voltage
 - GLOBALFOUNDRIES Partners With SVTC to Accelerate High-Volume MEMS Manufacturing

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