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NEWS:

Wednesday, July 29, 2009 | Partnership | 0 comments
Nextreme and Lockheed Martin Announce Cooperation Agreement for Development of Next Generation Thermal and Power Management Solutions
The agreement allows Lockheed Martin to use Nextreme's thin-film thermoelectric products and thermal and power management design services in solutions it is developing for government and civil applications.

Monday, July 27, 2009 | Partnership | 0 comments
Ghent University and IMEC reveal new optical forces
Groundbreaking results published in the premier scientific journal Nature Nanotechnology

Monday, July 27, 2009 | Partnership | 0 comments
Bruker and the University of Warwick Announce Collaboration for Further Development of Extreme Performance Mass Spectrometry
Bruker Daltonics announced today the establishment of a long-term collaborative programme for developing both applications and fundamental instrument technology in the area of extreme resolution mass spectrometry.

Friday, July 24, 2009 | Partnership | 0 comments
Owlstone Enters Into Development Contract With Leading International Gas Sensor Technology Company
The Owlstone ADS platform combines high sensitivity with mobility measurement in an extremely compact and efficient form factor.

Friday, July 24, 2009 | Partnership | 0 comments
Ciranova PyCells Adopted by STMicroelectronics for 32 Nanometer Physical Design Kit Development
PyCells are a form of “parameterized cell,” a basic building block for analog and mixed-signal IC layout. Under the agreement, Ciranova will provide training and consultation, as well as contract PyCell development.

Tuesday, July 21, 2009 | Partnership | 0 comments
Nano2012 Framework Agreement Celebrated at STMicroelectronics Crolles Site
Key European R&D program will build on European leadership in CMOS platforms and value-added application-specific derivative technologies

Thursday, July 16, 2009 | Partnership | 0 comments
IMEC and SUSS MicroTec to Collaborate on Wafer Bonding for 3D Integration Applications
Together, they will develop permanent bonding, temporary bonding and debonding processes for 3D system integration, including through-silicon-via (TSV) manufacturing.

Thursday, July 16, 2009 | Partnership | 0 comments
EV Group to Collaborate with Applied Materials On Thin Wafer Bonding Technology for 3D IC Development
The two companies will be working together as members of the EMC-3D Semiconductor 3D Equipment and Materials Consortium.

Thursday, July 16, 2009 | Partnership | 0 comments
Novellus Systems and UAlbany NanoCollege Launch $20 Million Nanoelectronics R&D Partnership
Leading Global Equipment Supplier to Locate Researchers and Cutting-Edge Tools at CNSE's Albany NanoTech to Support Development of Sub-22nm Chip Technologies

Sunday, July 12, 2009 | Partnership | 0 comments
Applied Nanotech Announces Exclusive Agreement for Copper Nano-Particle Inks With Prominent Chemical Company
Applied Nanotech Holdings, Inc. announced that it has entered into an exclusive worldwide license agreement with a leading industrial chemical products company in Japan for manufacturing and commercializing nano-copper inks and pastes.

Wednesday, July 08, 2009 | Partnership | 0 comments
SUSS MicroTec and Thin Materials Cooperate on Temporary Bonding Solution for 3D Packaging
Cooperating on a temporary bonding solution to be used for challenging thin wafer handling technologies required for emerging 3D Integration and Packaging technologies.

Friday, July 03, 2009 | Partnership | 0 comments
Syracuse University announces new agreement with Brookhaven National Laboratory
The tiny, nanoscale materials—quantum dots—Mathew Maye and his research team create in his Syracuse University chemistry laboratory could potentially make an important contribution to the nation’s ongoing quest to become energy independent.

Wednesday, July 01, 2009 | Partnership | 0 comments
Particle Sciences and Microfluidics Collaborate to Share Formulation and Nanotechnology Expertise for Pharmaceutical Drug Product Development, Analysis and Commercialization
Formed a strategic alliance to help biopharmaceutical companies leverage the most advanced and reliable nanotechnology and formulation methods available to develop, analyze and commercialize Active Pharmaceutical Ingredients (APIs).

Tuesday, June 23, 2009 | Partnership | 0 comments
3M and SUSS Announce Agreement on Temporary Wafer Bonding Technology to Enable 3-D Semiconductors
3M WSS uses processes and materials for temporary wafer bonding to support wafer thinning and processing of ultra thin wafers for 3-D packaging. 3M’s innovative use of a UV-curable adhesive for wafer bonding to glass carriers provides robust wafer support throughout wafer grinding.

Wednesday, June 17, 2009 | Partnership | 0 comments
Fluidigm Introduces New TOPAZ Protein Crystallization Chip That Provides a “Screen to Beam” Solution
Protein Structures Can Provide Keys to Understanding and Preventing Diseases of Catastrophic Proportions

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