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NEWS:

Tuesday, March 01, 2011 | Products | 0 comments
Nanometrics Announces Launch of its Mosaic II Overlay Metrology System and Selection by Leading Asian Customer
Announced the launch and delivery to a leading Asian memory customer of the Mosaic II, its newest turnkey image-based overlay metrology solution for advanced high-volume IC manufacturing.

Tuesday, March 01, 2011 | Products | 0 comments
CVD Equipment Corporation and Graphene Laboratories Inc. Expand Novel Line of CVDGraphene Products and Services
Offer commercial CVDGraphene research starter materials and customization services for transparent and conductive CVD grown Graphene films that we transfer onto a wide variety of substrates such as insulating silicon dioxide, plastic, and glass.

Monday, February 28, 2011 | Materials | 0 comments
Silicon Chip “Replaces” Rare Earths
Rare earths are an expensive and necessary component of strong permanent magnets. However, their use for this purpose can be optimised and thereby reduced. This has been demonstrated in computer simulations by a Special Research Program funded by the Austrian Science Fund FWF.

Monday, February 28, 2011 | Electronics | 0 comments
Imec and Renesas Electronics Announce Development of an Innovative SAW-Less Reconfigurable Transceiver
The fully reconfigurable transceiver ‘Scaldio’ is compatible with multiple wireless standards including the fourth generation mobile broadband standard 3GPP-LTE.

Monday, February 28, 2011 | Products | 0 comments
Versatile Ultra-low Power Biomedical Signal Processor
At International Solid-State Circuit Conference (ISSCC2011), imec, Holst Centre and NXP present a versatile ultra-low power biomedical signal processor, CoolBio, meeting the requirements of future wearable biomedical sensor systems.

Monday, February 28, 2011 | Products | 0 comments
Imec installs ASML’s pre-production EUV scanner NXE:3100
The installation of the NXE:3100, featuring a considerably higher source power and optimized optics, underscores imec’s ambition to bring EUVL to production level.

Monday, February 28, 2011 | Partnership | 0 comments
Samsung Selects Veeco MOCVD System for Advanced GaN-Based Power Electronics Research
Veeco Instruments Inc. announced today that Samsung Advanced Institute of Technology (SAIT) in Korea has selected Veeco’s TurboDisc K465i Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) System for advanced GaN on Si research for power electronics.

Monday, February 28, 2011 | MEMS | 0 comments
Freescale and CEA-Leti Celebrate 10 Years of MEMS Collaboration
Experts in MEMS technology design next generation sensors for automotive, industrial and consumer markets

Monday, February 28, 2011 | MEMS | 0 comments
Microelectronics Innovation Collaborative Centre Licenses Alchimer’s Wet Deposition Products for MEMS 3D Research
Canadian Research-and-Development Consortium Will Use Wet Deposition Technology to Advance MEMS Production

Monday, February 28, 2011 | Products | 0 comments
NanoPhotonica Develops Breakthrough Technology for QLED Flat Panel Displays
The company’s S-QLED technology improves on the picture quality and power consumption achieved by recently introduced OLED displays, while significantly reducing cost and improving lifetime well beyond what OLED can achieve.

Monday, February 28, 2011 | Products | 0 comments
NanoString Technologies Introduces Multiplexed Assay Kit for Human Molecular Karyotyping
Panel Provides Cost Effective Way to Monitor Cell Line Quality, Perform Cytogenetics Research

Monday, February 28, 2011 | Partnership | 0 comments
CEA-Leti and its Startup ASELTA Create Joint Lab to Address Manufacturing Challenges of Mask and Direct-Write Lithography
CEA-Leti and ASELTA Nanographics, its newly incorporated startup, today announced they will jointly develop e-beam proximity effects correction solutions for both mask writing and maskless lithography (ML2) applications.

Monday, February 28, 2011 | Electronics | 0 comments
CEA-Leti: Chip-to-Wafer Direct-Metallic-Bonding Technology Developed at Leti Used in Customized 300mm Device Bonder
CEA-Leti Partnering with SET, STMicroelectronics, ALES and CNRS-CEMES On Advanced Chip-to-Wafer Technologies for 3D Integration

Monday, February 28, 2011 | Partnership | 0 comments
CEA-Leti: Magillem Design Services and CEA Sign Multi-Year Collaboration Agreement
Development of a Unified Hardware/Software Design Platform For Complex Systems-on-Chip

Monday, February 28, 2011 | Events | 0 comments
CEA-Leti: 2011 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics Set for May 23-26 in Grenoble
MINATEC Innovation Campus Is IC-FCMN’s First Conference Venue Outside U.S.

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