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NEWS:

Thursday, July 17, 2008 | Products | 0 comments
Nanometrics Introduces the Lynx Metrology System
The Lynx is the industry's first compact 300mm cluster metrology platform to enable thin film, optical critical dimension (OCD) and overlay measurements in a single system.

Tuesday, July 15, 2008 | Products | 0 comments
FEI Connectivity Solutions Improve and Accelerate TEM Imaging for Semiconductor Manufacturing
By accelerating and improving the quality of preparation, imaging and analysis of the ultra-thin samples required for transmission electron microscopy (TEM), the FEI Connectivity Solutions can reduce a lab's "wafers-to-atoms" time from days to hours.

Tuesday, July 15, 2008 | Products | 0 comments
CombiMatrix Receives New Contract From U.S. Department of Defense
Under previous contracts with the Department of Defense, CombiMatrix has developed and demonstrated assays for the simultaneous detection of toxins, viruses, and bacteria using immunoassay and genetic analysis.

Tuesday, July 15, 2008 | Products | 0 comments
SVTC Expands MEMS Capabilities
New Tools and Processes Designed to Enable Next-Generation MEMS Development

Tuesday, July 15, 2008 | Products | 0 comments
Numonyx Brings Industry Leading 65-Nanometer StrataFlash Technology to Embedded NOR Market
Now Sampling High-Density Industry Standard Family to Provide Embedded Customers Choice, Long Product Life and Price/Performance

Tuesday, July 15, 2008 | Products | 0 comments
SUSS MicroTec Unveils 300mm Mask Aligner for 3D Packaging
The new 3D-Alignment platform enables bottom side and infrared alignment for 300mm based three-dimensional (3D) packaging lithography applications, thereby enabling cost effective mask aligner systems to meet the most aggressive technology roadmaps for thick resist applications and keep costs low relative to 1X Stepper lithography solutions.

Tuesday, July 15, 2008 | Products | 0 comments
Applied Materials Delivers Critical Copper Barrier Technology for Memory Chips with Extensa PVD System
The Extensa systemís unique titanium/titanium nitride (Ti/TiN) process technology enables diffusion barrier films with benchmark step coverage and <3% film thickness non-uniformity across the wafer, while achieving best-in-class defectivity and >25% lower CoC2 than competing systems.

Tuesday, July 15, 2008 | Products | 0 comments
Applied Materialsí New eHARP System Extends Production-Proven STI Gap-Fill Technology to 32nm and Beyond
Featuring proprietary new process innovations, the eHARP systemís robust, high-density, strain-inducing films enable the scaling of conventional planar and emerging 3-D device structures.

Tuesday, July 15, 2008 | Products | 0 comments
Industrial Nanotech, Inc. Expands New EPX Product Line
EPX-K will offer the same outstanding corrosion and chemical resistance as their EPX-4 product, with increased thermal resistance and greater ease of application due to lower viscosity.

Sunday, July 13, 2008 | Products | 0 comments
Applied Materials Launches Breakthrough E3 Equipment and Process Control Solution for Boosting Fab Productivity
The Applied E3 system uniquely integrates all critical equipment automation and process control components to deliver the most flexible, user-friendly and powerful fab-wide Equipment Engineering System solution on the market today.

Sunday, July 13, 2008 | Products | 0 comments
Aviza Technology Receives Order for Celsior fxP ALD System From a Leading Logic Manufacturer in Japan
Received an order for its Celsior fxP single wafer atomic layer deposition (ALD) system from a leading advanced logic integrated circuit (IC) manufacturer in Japan.

Thursday, July 10, 2008 | Products | 0 comments
EV Group Supplies 300-mm Equipment to STMicroelectronics for the Manufacture of Image Sensors Using TSV Technology
Major multi-million-euro order from STMicroelectronics for its 300-mm bonding, alignment and photoresist processing tools.

Thursday, July 10, 2008 | Products | 0 comments
Tegal Receives 901ACS Plasma Etch System Order and ACS Upgrade Orders From Leading Maker of Commercial BioMEMS-Based Medical Testing Products
ACS Functionality and Sophistication Provide Winning Combination of UI Features and Software Robustness for Medical Device Production

Thursday, July 10, 2008 | Products | 0 comments
Deep Photonics Introduces a Flexible Picosecond Pulsed 266 nm Fiber Laser
New Laser Platform Designed Specifically for Photovoltaic Applications

Tuesday, July 08, 2008 | Products | 0 comments
SUSS MicroTec Delivers Coat/Develop Cluster to Replisaurus Technologies
The modular coat/bake/develop cluster from SUSS represents the latest generation technology in high volume production spin coating.

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